JPH0215992B2 - - Google Patents

Info

Publication number
JPH0215992B2
JPH0215992B2 JP57143195A JP14319582A JPH0215992B2 JP H0215992 B2 JPH0215992 B2 JP H0215992B2 JP 57143195 A JP57143195 A JP 57143195A JP 14319582 A JP14319582 A JP 14319582A JP H0215992 B2 JPH0215992 B2 JP H0215992B2
Authority
JP
Japan
Prior art keywords
board
lead frame
circuit board
frame
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57143195A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5933855A (ja
Inventor
Noritaka Koshiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wako Sangyo KK
Original Assignee
Wako Sangyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wako Sangyo KK filed Critical Wako Sangyo KK
Priority to JP14319582A priority Critical patent/JPS5933855A/ja
Publication of JPS5933855A publication Critical patent/JPS5933855A/ja
Publication of JPH0215992B2 publication Critical patent/JPH0215992B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP14319582A 1982-08-20 1982-08-20 リ−ドフレ−ム基板插入装置 Granted JPS5933855A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14319582A JPS5933855A (ja) 1982-08-20 1982-08-20 リ−ドフレ−ム基板插入装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14319582A JPS5933855A (ja) 1982-08-20 1982-08-20 リ−ドフレ−ム基板插入装置

Publications (2)

Publication Number Publication Date
JPS5933855A JPS5933855A (ja) 1984-02-23
JPH0215992B2 true JPH0215992B2 (en]) 1990-04-13

Family

ID=15333075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14319582A Granted JPS5933855A (ja) 1982-08-20 1982-08-20 リ−ドフレ−ム基板插入装置

Country Status (1)

Country Link
JP (1) JPS5933855A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0328686U (en]) * 1989-07-31 1991-03-22
JP2508416B2 (ja) * 1990-12-07 1996-06-19 ローム株式会社 液晶表示素子又はプリント基板等へのリ―ド端子の装着装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143196A (en) * 1981-02-26 1982-09-04 Asahi Glass Co Ltd Fan for high temperature use

Also Published As

Publication number Publication date
JPS5933855A (ja) 1984-02-23

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